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Device: S3F80L4 [SOP32]

Manufacturer: Samsung

Part number description for this device:

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S System LSI  
3 Microcontroller  
X Family Type C = Mask ROM
F = FLASH
3 = MCP
E = EVA-CHIP
P = OTP
X Core 1 = 51 4-bit
2 = 32-bit ARM9
3 = 17 16-bit
4 = 32 32-bit
5 = 32-bit ARM10
6 = 56 4-bit
7 = 57 4-bit
8 = 88 8-bit
9 = 86 8-bit
A = 15 Other
B = 8-bit CALM RISC MAC
C = 16-bit CALM RISC MAC
D = 32-bit CALM RISC MAC
I = Custom MCU
J = SC-200
K = 8-bit CALM RISC
L = 16-bit CALM RISC
R = 128-bit CALM RISC
S = SC-100
XX Application Category 0n = General Purpose
1n = Voice
2n = LCD
3n = Audio
4n = General A/D
5n = Telecom
6n = PC & Peripherial, OA
7n = VFD
8n = Video
9n = Special (IC Card)
An = General Purpose-1
Cn = C
Fn = Telecom-1
Nn = Intel Application
Zn = Assigment Code "n" Serial No. (1~Z)
X ROM Master 0ROMless
1 = 1kx8
2 = 2kx8
3 = 12kx8
4 = 4kx8
5 = 16kx8
6 = 6kx8
7 = 24kx8
8 = 8kx8
9 = 32kx8
A = 48kx8
B = 64kx8
C = 96kx8
D = 128kx8
F = 256kx8
G = 384kx8
H = 512kx8
J = 768kx8
K = 1Mx8
W = 144kx8
X Version  
XX Mask Option  
XX Package Type A = SDIP
B = LGA
C = Chip BIZ
D = DIP
E = LQFP
F = WQFP
G = BGA
H = CSP
J = BQFP
K = UELP
L = ELP
M = QFPH
N = COB
P = PLCC
R = TSSOP
Q = QFP
S = SOP
T = TQFP
V = SSOP
W = Waffer
Y = FBGA
Z = SBGA
X Package Pin SDIP package:
B=56, M=24, O=32, Q=42, T=64, V=30
LGA package:
A=88, C=83, J=176
DIP package:
C=8, H=16, I=18, K=20, N=28, P=40
LQFP package:
C=144, D=160, E=208, G=256, J=176, R=48, T=64, W=80, X=100
WQFP package:
T=64
BGA package:
A=272, B=416, C=496, D=153
CSP package:
J=176
BQFP package:
B=132
UELP package:
T=64
ELP package:
R=48, T=64
QFPH package:
D=160, F=240
COB package:
C=8, D=8CNCL
PLCC package:
C=52, Z=44
TSSOP package:
R=48
QFP package:
A=128, C=144, D=160, E=208, G=256, R=48, T=64, U=304, W=80, X=100, Z=44
SOP package:
C=8, H=16, I=18, K=20, M=24, N=28, O=32
TQFP package:
A=128, T=64, W=80, X=100
TEBGA package:
X=492
FBGA package:
A=337, B=81, C=144, D=160, E=208, F=180, G=285, H=320, K=105,
L=400, O=272, P=504, Q=289, T=64, U=83, X=100
SBGA package:
A=432
SSOP package:
H=16, K=20
X Packing B = Tube
U = Bulk
R = Tray
T = Tape & Reel
S = Tape & Reel reverse
C = Chip Biz
D = Chip Biz (3 inch tray)
E = Chip Biz (4 inch tray)
F = Chip Biz (reverse)
W = WF Biz Draft Wafer
X = WF Biz Full Cutting
7 = Tape & Reel (Pb-Free PKG)
8 = Tray (Pb-Free PKG)
9 = Tube (Pb-Free PKG)
X ROM Size 0ROMless
1 = 1kx8
2 = 2kx8
3 = 12kx8
4 = 4kx8
5 = 16kx8
6 = 6kx8
7 = 24kx8
8 = 8kx8
9 = 32kx8
A = 48kx8
B = 64kx8
C = 96kx8
D = 128kx8
E = Extended
F = 256kx8
G = 384kx8
H = 512kx8
J = 768kx8
K = 1Mx8
M = Military
N = Industrial
W = 144kx8
X = Special MK3
Y = Special MK2
Z = Special MK1

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL32/SOIC32 ZIF-CS 330mil (70-3331)
BeeHive208S adapter/module: DIL32/SOIC32 ZIF-CS 330mil (70-3331)
BeeProg2 adapter/module: DIL32/SOIC32 ZIF-CS 330mil (70-3331)
BeeProg2C adapter/module: DIL32/SOIC32 ZIF-CS 330mil (70-3331)
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